Emergent Futures Tumblelog

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December 13th 2011

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First commercial 3-D chip-making capability announced

IBM’s advanced TSV chip-making process enables Micron’s Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today’s technology.

Full Story: Kurzweil

Posted at 1:26pm and tagged with: tech, technology, computers, Moore's law,.

First commercial 3-D chip-making capability announced IBM’s advanced TSV chip-making process enables Micron’s Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today’s technology. Full Story: Kurzweil
  1. edisonsdesk reblogged this from emergentfutures
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    15X Faster!!!!!!!!!!!!!! = Cheaper, Easier, Bigger, Better = More and More Complexity…Learn How
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  5. This was featured in #Tech
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